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| CTLSH1-40M322 SURFACE MOUNT HIGH CURRENT, LOW VF SILICON SCHOTTKY DIODE TINY LEADLESS MODULETM Central DESCRIPTION: TM Semiconductor Corp. LOW VF Top View Bottom View The CENTRAL SEMICONDUCTOR CTLSH1-40M322 is a low VF Schottky diode designed for applications where small size and operational efficiency are prime requirements. With a maximum power dissipation of 1.45W, and a very small package footprint (approximately equal to the SOT-363), this Tiny Leadless Module (TLM) is capable of dissipating up to 4 times the power of similar devices in a comparable surface mount package. MARKING CODE: CBA APPLICATIONS: * DC/DC Converters * Reverse Battery Protection * Battery powered applications (Cell phones, PDAs, Digital Camera, MP3 Players, etc.) TLM322 CASE FEATURES: * High Current (IF = 1.0A) * Low Forward Voltage Drop (VF=0.55V Max @ 1.0A) * High Thermal Efficiency MAXIMUM RATINGS: (TA=25C) Peak Repetitive Reverse Voltage Continuous Forward Current Peak Repetitive Forward Current, tp 1ms Forward Surge Current, tp = 8ms Power Dissipation Operating and Storage Junction Temperature Thermal Resistance ELECTRICAL CHARACTERISTICS: SYMBOL IR IR IR BVR VF VF VF VF CJ trr TEST CONDITIONS VR= 5.0V VR= 8.0V VR= 15V IR= 100A IF= 10mA IF= 100mA IF= 500mA IF= 1.0A VR= 4.0V, f= 1.0MHz SYMBOL VRRM IF IFRM IFSM PD TJ, Tstg JA 40 1.0 3.5 10 1.45 -65 to +150 86.20 UNITS V A A A W* C C/W* (TA=25C unless otherwise noted) MIN TYP MAX 10 20 50 UNITS A A A V V V V V pF ns 40 0.29 0.36 0.45 0.55 50 15 IF=IR= 500mA, Irr= 50mA, RL= 50 * FR-4 Epoxy PC Board with copper mounting pad area of 21 mm2 R2 (10-April 2006) Central TM CTLSH1-40M322 SURFACE MOUNT HIGH CURRENT, LOW VF SILICON SCHOTTKY DIODE TINY LEADLESS MODULETM Semiconductor Corp. TLM322 CASE - MECHANICAL OUTLINE Suggested mounting pad layout for maximum power dissipation (Dimensions in mm) LEAD CODE: 1) CATHODE 2) ANODE 3) ANODE MARKING CODE: CBA For standard mounting refer to TLM322 Package Details R2 (10-April 2006) |
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